Ansys Collaborates with TSMC and Microsoft to Accelerate Mechanical Stress Simulation for 3D-IC Reliability in the Cloud
The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability
/ Key Highlights
- Managing thermal mechanical stress is crucial for 3D-IC reliability and robustness
Ansyscollaborated with TSMC and Microsoft to enable a fast, and high-capacity solution for analyzing mechanical stresses in multi-die designs using TSMC's 3DFabric technologies
- Ansys Mechanical simulates the stresses in large, 3D integrated circuits with predictive accuracy to enable robust and reliable products
Ansys Mechanical is the industry-leading finite element analysis software used to simulate mechanical stresses caused by thermal gradients in 3D-ICs. The solution flow has been proven to run efficiently on Microsoft Azure, helping to ensure fast turn-around times with today's very large and complex 2.5D/3D-IC systems.
3D-IC systems often have large temperature gradients that lead to intense mechanical stresses between components due to differential thermal expansion. These stresses can lead to cracking or shearing of the connections between various elements and reduce the reliable lifespan of a 3D-IC assembly. As the size and complexity of semiconductor systems grow it becomes more difficult to analyze them efficiently. Ansys Mechanical, running on Azure's purpose-built HPC infrastructure, is instrumental in scaling up computationally demanding stress simulations while maintaining predictive accuracy. By automating highly complex thermo-mechanical stress simulations, Ansys Mechanical can simulate massive models due to a highly efficient hybrid parallel solver that supports cost-effective computing by using on-demand cloud computing resources like Azure.
"In face of the design challenges brought by the growing size and complexity of semiconductor systems, the accurate analysis results become critical for the 3D IC design using TSMC's latest 3DFabric technologies," said
"With this valuable collaboration between
"Microsoft and Ansys have collaborated to provide optimized cloud solutions for some of the biggest semiconductor design challenges with Microsoft Azure's cloud resources and on-demand elastic compute capabilities," said
/ About Ansys
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