Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow
Ansys RedHawk-SC™ and RedHawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ for simpler and more efficient 3D-IC implementation with TSMC 3DFabric™ technologies
/ Key Highlights
- Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design
- RedHawk-SC and RedHawk-SC Electrothermal are included in TSMC's 3Dblox Reference Flow for power integrity and thermal reliability signoff of designs using TSMC 3DFabric technologies
Many of the world's most advanced silicon systems for high performance computing, artificial intelligence, machine learning, and graphic processing are made possible thanks to 3D-IC. Both TSMC's 3Dblox standard and the reference flow will make it easier and more efficient for
"TSMC's advanced 3DFabric technologies and manufacturing expertise have been on the forefront of enabling the industry-wide trend toward multi-chip 3D-IC semiconductor systems," said Dan Kochpatcharin, head of
3Dblox is designed to make modular top-down design of complex 2.5D and 3D systems easier and also to promote chiplet reuse. As a standardized interface format for design data, it makes it easier for TSMC's customers to take full advantage of the many technology configurations available under TSMC's 3DFabric technologies, including CoWoS®, InFO, TSMC-SoIC™, and more. The reference flow provides strong guidance on multiphysics solutions like RedHawk-SC that are certified to address real design challenges in an open platform approach.
Ansys RedHawk-SC ElectroThermal is integrated within the high-capacity cloud-native SeaScape platform and supports multi-chip 2.5D/3D-IC packages thermal integrity analysis. It can be used for early-design exploration, post-layout design verification, and silicon signoff of multi-die systems.
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