Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions
/ Key Highlights
Ansyssecured an award in the category of Joint Developmentof 2nm and N3P Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and reliability signoff verification tools for TSMC's newest process technologies Ansysearned an award in the category of Joint Developmentof 3Dblox Design Prototyping Solution to provide power integrity and thermal feasibility analysis for TSMC's 3DFabric advanced packaging technologies Ansysearned two awards in the categories of Joint Developmentof Millimeter-Wave Design Solutions and Partner Collaboration for two years of collaborative effort and the delivery of four reference flows that showcase the synergy of the OIP ecosystem
TSMC announced award winners at its 2023
- TSMC's OIP Partner of the Year award for
Joint Developmentof 2nm and N3P Design Infrastructure recognizes that Ansyspower integrity and reliability solutions remain on the forefront of silicon process enablement and voltage drop signoff.
- The OIP Partner of the Year award for
Joint Developmentof 3Dblox Design Prototyping Solution follows the delivery of comprehensive support by Ansys RedHawk-SC™, Ansys RedHawk-SC Electrothermal™, and Ansys Totem™ for TSMC's 3DBlox language standard for easy interchange of 3D-IC design data.
- Both the OIP Partner Collaboration award and the
Joint Developmentof Millimeter-Wave Design Solutions award reflect the two tiers of collaborative effort with OIP partners to jointly develop four reference flows for radio-frequency (RF) design enablement with Ansys RaptorX™, Ansys Exalto™, Ansys VeloceRF™, and Ansys Totem™ across multiple TSMC process technologies.
"TSMC is a leading technology innovator in the semiconductor industry and working closely with TSMC has been an essential component in the success of our multiphysics signoff technology products," said
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