AWR and ANSYS Partner to Bring HFSS into Microwave Office for Circuit Designers
With this design flow, Microwave Office users can readily access HFSS for analysis of EM fields and coupling of 3-D structures like passive components, bumps, bond wires, and pins which are essential to successfully designing and realizing microwave circuits like monolithic microwave integrated circuits (MMICs), densely-populated RF circuit boards and multifunction modules.
The link between the two software tools is leveraged from AWR's innovative EM Socket™ open standard interface, which enables AWR users to access a broad range of electromagnetic (EM) tools from within the Microwave Office design environment. The EM Socket architecture also allows AWR Microwave Office users to essentially simulate EM structures with a single mouse click using either AWR's AXIEM® 3D planar method of moments solver or Analyst™ 3D finite element method EM software.
In addition to enabling ANSYS HFSS 3D EM simulation capabilities from within the NI/AWR Design Environment, the connection allows the resulting 3D layered format exported from the EM Socket interface to connect to the ANSYS multiphysics portfolio. That suite includes ANSYS SIwave® for signal/power integrity analysis and ANSYS Icepak® for thermal characterization.
"This dynamic combination of two industry-leading applications is exactly what our customers have been asking for," said Larry Williams, director of product management at ANSYS. "ANSYS has revolutionized the simulation of 3-D electromagnetics while AWR is a world leader in microwave circuits. I'm confident that this new offering will help our joint customers create exciting new products that will amaze the market."
"Collaborating with third-party firms to expand both the breadth and depth of technology available within the NI AWR Design Environment has been a mainstay of our product offering," said Sherry Hess, vice-president of marketing at AWR. "The ease with which our Microwave Office customers can now access HFSS technology will indeed be very welcome news."
To learn more about the AWR Microwave Office / ANSYS HFSS flow, attend the joint MicroApp talk, A Streamlined Design Flow Featuring AWR Microwave Office® and ANSYS HFSS presented at 11:10am ET on Tuesday, June 3rd in the IMS2014 MicroApp Theater or visit AWR in booth #633 or ANSYS in booth #1433.
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs nearly 2,700 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of
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About AWR, A National Instruments Company
AWR, the innovation leader in high-frequency electronic design automation (EDA) software, is a National Instruments Company. AWR's software portfolio of EDA solutions dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications. Learn more at www.awrcorp.com.
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© 2014 AWR Corporation. All rights reserved. AWR is a National Instruments Company. AWR, Microwave Office, and AXIEM are registered trademarks and the AWR logo, NI AWR Design Environment, EM Socket, and Analyst are trademarks of AWR Corporation. Other product and company names listed are trademarks or trade names of their respective companies.
Contact:
Sherry Hess
Vice President of Marketing
AWR Corporation
(310) 726-3000
hess@awrcorp.com
Media: Tom Smithyman
724.514.3076
tom.smithyman@ansys.com
Investors: Annette Arribas, CTP
724.514.1782
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.